TL;DR
Intel has appointed Seok-Hee Lee, former SK hynix CEO, as executive vice president to lead its foundry’s advanced packaging and back-end technology. The move signals a focus on high-volume, high-margin packaging solutions amid ongoing industry challenges.
Intel has appointed Seok-Hee Lee, the former chief executive of SK hynix and SK On, as executive vice president of Intel Foundry, to oversee advanced packaging, system integration, and back-end manufacturing. This strategic hire aligns with Intel’s focus on strengthening its high-margin packaging business and reflects a major leadership shift within the company’s foundry operations.
Seok-Hee Lee’s appointment was announced by Intel on May 2024, where he reports directly to CEO Lip-Bu Tan. Lee’s role involves leading the company’s advanced packaging efforts, including system integration and back-end technology development. Intel is restructuring its foundry division by creating a dedicated business unit for advanced packaging, with Naga Chandrasekaran focusing on front-end process nodes such as Intel 18A and 14A.
Lee’s background includes nearly a decade at Intel earlier in his career, followed by leadership roles at SK hynix, one of the world’s largest suppliers of high-bandwidth memory. His expertise in high-scale technology and manufacturing is seen as critical for Intel’s ambitions to improve yields and scale high-volume packaging solutions like EMIB-T and HBM4, which are key to Intel’s competitive positioning against TSMC and other foundry rivals. Last month, SK hynix was reported to be testing Intel’s EMIB packaging technology for HBM integration, indicating ongoing collaboration.
Intel’s foundry division reported a loss of $10.3 billion in 2025, with revenue of $17.8 billion. The company projects that packaging revenue could surpass $1 billion with gross margins near 40%, driven by hyperscaler commitments. Lee’s experience managing complex back-end processes is viewed as vital for addressing yield issues and scaling high-volume manufacturing, especially for AI and high-performance computing applications.
Strategic Impact of Lee’s Leadership on Intel Foundry
Lee’s appointment signals Intel’s renewed focus on strengthening its high-margin back-end packaging capabilities, which are critical for AI, high-performance computing, and advanced chip integration. His expertise in high-volume manufacturing and complex packaging technologies aims to improve yields and scale production, directly impacting Intel’s competitiveness and profitability in the foundry market. The move also reflects industry shifts toward integrated solutions like EMIB-T and HBM4, which are essential for next-generation AI accelerators and high-bandwidth memory modules.
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Industry Challenges and Intel’s Packaging Strategy
Intel’s foundry division has faced significant financial and technical challenges, including high costs and yield issues in back-end processes. The company reported substantial losses in 2025, partly due to difficulties in scaling proprietary packaging technologies. Meanwhile, the industry has seen a surge in demand for advanced packaging solutions, with TSMC dominating the market with its CoWoS technology, which has been oversubscribed for over two years. Intel’s focus on EMIB-T and HBM4 reflects a strategic effort to compete in this high-margin segment, with partnerships and testing collaborations indicating a push for high-volume production.
Lee’s previous experience in memory and back-end manufacturing positions him as a key figure in addressing these challenges. His return to Intel follows recent leadership changes, including the recruitment of Samsung foundry veteran Shawn Han, and signals a strategic shift toward high-volume, high-margin packaging solutions amid ongoing industry pressures.
“Lee’s deep expertise in leading complex, high-scale technology and manufacturing organizations will be instrumental for Intel’s ambitions in advanced packaging.”
— an anonymous researcher
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Unresolved Questions About Lee’s Immediate Impact
It is not yet clear how quickly Lee will be able to address existing yield and manufacturing challenges at Intel’s back-end processes. The timeline for ramping high-volume production of EMIB-T and HBM4 technologies remains uncertain, as does the extent of collaboration with industry partners like SK hynix and major hyperscalers. Details about specific projects or targets under Lee’s leadership have not been publicly disclosed, and the full impact of his appointment on Intel’s financial recovery is still to be seen.
Intel high-margin packaging solutions
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Upcoming Milestones for Intel’s Packaging Initiatives
Intel is expected to announce further details on its packaging roadmap and production timelines in upcoming quarterly reports. The company may also reveal new partnerships or test results related to EMIB-T and HBM4 integration. Lee’s immediate focus will likely be on stabilizing yields and scaling manufacturing capacity, with key milestones including the rollout of EMIB-T in production fabs later this year and potential collaborations with cloud providers like Google and Amazon for custom AI chip packaging.
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Key Questions
What does Seok-Hee Lee’s appointment mean for Intel’s foundry business?
It indicates a strategic focus on strengthening advanced packaging and back-end manufacturing, aiming to improve yields, scale high-volume production, and compete more effectively with rivals like TSMC.
How does Lee’s background support Intel’s current goals?
His extensive experience in high-scale manufacturing, memory, and complex packaging technologies makes him well-suited to address Intel’s yield issues and lead the development of high-margin packaging solutions like EMIB-T and HBM4.
When will we see tangible results from Lee’s leadership?
Intel is expected to provide updates on its packaging technology milestones in upcoming quarterly reports, with production ramp-ups and collaborations likely within the next year.
Will Lee’s appointment affect Intel’s financial performance?
While his leadership aims to improve manufacturing efficiencies and margins, the full financial impact will depend on successful scaling and industry demand for advanced packaging solutions.
What are Intel’s main competitors in advanced packaging?
TSMC is the leading competitor with its CoWoS technology, which has been oversubscribed for years. Intel aims to challenge this with EMIB-T and HBM4, supported by Lee’s expertise.
Source: Tom’s Hardware: For The Hardcore PC Enthusiast
